| 摘要 |
<p>A microelectromechanical mirror and mirror array are manufactured by etching and bonding. Control electrodes(108, 109) and addressing circuitry are etched from a metallic layer deposited onto a reference layer substrate (110). Standoff-posts are etched from a subsequently deposited polyimide layer. A freely movable plate (102) flexibly suspended (104, 105) from a plurality of electrostatic actuators (103) that are flexibly suspended from a support frame is etched from an actuation layer substrate using a high aspect ratio etch. A mirror support post (120) and surface are etched from a mirror substrate using a high aspect ratio etch. The mirror and actuation layer substrates are fusion bonded together. The reference and actuation layer substrates are bonded together and held apart by the standoff posts. A reflective metallic layer is deposited onto the mirror surface and polished. The mirror is etched from the mirror surface to free the microelectromechanical mirror. Mirror arrays are made by performing the aforementioned steps using standard IC processing techniques.</p> |
