发明名称 |
Processor module with thermal dissipation device |
摘要 |
Embodiments include apparatus, methods, and systems of a processor module for a system board. An electronic module is removably connectable to a system board. The electronic module has first and second portions. The first portion is connected to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device extends between the processor and the system board. The second portion connects on top of the first portion and has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.
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申请公布号 |
US2006126297(A1) |
申请公布日期 |
2006.06.15 |
申请号 |
US20040011328 |
申请日期 |
2004.12.13 |
申请人 |
BELADY CHRISTIAN L;WILLIAMS GARY W;HARRIS SHAUN L;BELSON STEVEN A;PETERSON ERIC C |
发明人 |
BELADY CHRISTIAN L.;WILLIAMS GARY W.;HARRIS SHAUN L.;BELSON STEVEN A.;PETERSON ERIC C. |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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