| 摘要 |
PROBLEM TO BE SOLVED: To remove both comparatively large particles firmly adhering on a wafer and comparatively small particles deposited in a recess on the surface of the wafer. SOLUTION: A first sponge brush 35 and a second sponge brush 36 are provided on the lower surface of a cleaning head 12. The sponge brush 35 is formed to be highly rigid so that it can remove the comparatively large particles firmly adhering on the wafer 14. The sponge brush 36 is formed to be low-rigid so that it can remove the comparatively small particles deposited in the recess of the wafer 14. The cleaning head 12 is driven to rotate in a state of abutting on the surface of the wafer 14. COPYRIGHT: (C)2008,JPO&INPIT
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