发明名称 CURABLE COMPOSITION, BONDING METHOD AND BONDED BODY
摘要 Disclosed is a curable composition which exhibits a temporary fixing effect extremely quickly and is completely cured in a short time at room temperature. Also disclosed are an adhesive and a bonding method. Specifically disclosed is a curable composition characterized by containing a polymerizable acrylic liquid composition as a component (A), a cumenehydroperoxide as a component (B), a metal reducing agent containing vanadium or copper or a reducing agent composed of ethylenethiourea as a component (C), and a basic compound containing a primary amine structure, a secondary amine structure or a tertiary amine structure as a component (D). Also specifically disclosed is a bonding method using such a curable composition.
申请公布号 WO2008108273(A1) 申请公布日期 2008.09.12
申请号 WO2008JP53542 申请日期 2008.02.28
申请人 DENKI KAGAKU KOGYO KABUSHIKI KAISHA;HISHA, YUKI;YODA, KIMIHIKO 发明人 HISHA, YUKI;YODA, KIMIHIKO
分类号 C08F220/28;C08F2/44;C08F220/30;C08L79/02;C09J4/02;C09J5/04;C09J11/06 主分类号 C08F220/28
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