| 发明名称 | Solid electrolytic capacitor with high temperature leakage stability | ||
| 摘要 | A solid electrolytic capacitor and method for forming a solid electrolytic capacitor with high temperature leakage stability is described. The solid electrolytic capacitor has improved leakage current and is especially well suited for high temperature environments such as down-hole applications. | ||
| 申请公布号 | US9362056(B2) | 申请公布日期 | 2016.06.07 |
| 申请号 | US201314063205 | 申请日期 | 2013.10.25 |
| 申请人 | Kemet Electronics Corporation | 发明人 | Chacko Antony P.;Hahn Randolph S.;Ruiz Pablo Antonio |
| 分类号 | H01G9/048;H01G9/00;H01G9/012;H01G9/15;C25D7/00;C25D11/26;H01G9/025;C25D11/04 | 主分类号 | H01G9/048 |
| 代理机构 | Perkins Law Firm, LLC | 代理人 | Guy Joseph T.;Perkins Law Firm, LLC |
| 主权项 | 1. A method for forming a solid electrolytic capacitor with high temperature leakage stability comprising: providing an anode; forming a dielectric on said anode; applying a cathode on said dielectric; applying a transition layer on said cathode wherein said transition layer comprises a blocking layer; plating a metal layer on said transition; and electrically connecting a cathode termination to said cathode wherein said solid electrolytic capacitor has a leakage of no more than 0.10 CV after 500 hrs at temperature of at least 200° C. | ||
| 地址 | Simpsonville SC US | ||