| 摘要 |
The present invention relates to a method for bonding a first substrate (4) with a second substrate (4'), wherein the first substrate (4) and/or the second substrate (4') are/is thinned before bonding. The substrates (4, 4') may be wafers, semiconductor substrates, metallic substrates, mineral substrates, more particularly sapphire substrates, glass substrates or polymer substrates. The first substrate (4) and/or the second substrate (4') are/is fixed for thinning and/or bonding on a carrier surface (3o, 3o') of a carrier (3, 3'), more particularly having a ring-shaped frame (2). The first substrate (4) and the second substrate (4') are aligned with one another before bonding on the basis of corresponding alignment markings of the substrates (4, 4') and are subsequently pre-fixed, more particularly magnetically. Substrate fixings respectively have a substrate fixing surface (9) for respectively fixing a substrate (4, 4') and respectively have a carrier fixing surface (8) or carrier fixing region surrounding the substrate fixing surface (9), for the mutual fixing of the substrate fixings, wherein in particular the carrier fixing surface (8) or the carrier fixing region is magnetised or magnetizable, or alternatively the substrate fixings can be fixed to one another by means of an adhesive, by means of clamps, by means of a plug system or electrostatically. |
