| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board, achieving a short manufacturing time.SOLUTION: A central conductor layer 34C is formed by using a semi-additive method in a first resin insulation layer 20F, and a second conductor layer 34S is formed by using a tenting method in a second resin insulation layer 20S. Only the central conductor layer required for fine pitch is formed by using a semi-additive method that takes time, and the second conductor layer 34S not required for fine pitch is formed by using a tenting method that can be performed for a short time, so that a manufacturing time of a printed wiring board can be reduced.SELECTED DRAWING: Figure 1 |
