FLIP-CHIP LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME

摘要

This invention relates to a flip-chip light-emitting diode and a method for manufacturing the same. The flip-chip light-emitting diode comprises a packaging body and a conductor layer. At least one light-emitting diode chip is encapsulated in the packaging body. The light emitting diode chip has a positive electrode and a negative electrode which are exposed on a side surface of the packaging body. The conductor layer is disposed on the side surface of the packaging body and directly in contact with the positive electrode and the negative electrode of the light-emitting diode chip. The conductor layer has circuit patterns and an insulating portion insulating the positive electrode and the negative electrode of the light-emitting diode chip from each other.

主权项

1. A method for manufacturing a flip-chip light-emitting diode, the method comprising steps of:
providing a packaging body including at least one light-emitting diode chip which has a positive electrode and a negative electrode that are exposed on a side surface of the packaging body; and forming a conductor on the side surface of the packaging body, wherein the positive electrode and the negative electrode of the light-emitting diode chip are insulated from each other.