发明名称 NITRIDE SEMICONDUCTOR ULTRAVIOLET LIGHT-EMITTING ELEMENT
摘要 A nitride semiconductor ultraviolet light-emitting element is provided with: an underlying structure portion including a sapphire (0001) substrate and an AlN layer formed on the substrate; and a light-emitting element structure portion including an n-type cladding layer of an n-type AlGaN based semiconductor layer, an active layer having an AlGaN based semiconductor layer, and a p-type cladding layer of a p-type AlGaN based semiconductor layer, formed on the underlying structure portion. The (0001) surface of the substrate is inclined at an off angle which is equal to or greater than 0.6° and is equal to or smaller than 3.0°, and an AlN molar fraction of the n-type cladding layer is equal to or higher than 50%.
申请公布号 US2016240727(A1) 申请公布日期 2016.08.18
申请号 US201615140300 申请日期 2016.04.27
申请人 SOKO KAGAKU CO., LTD. 发明人 PERNOT CYRIL;HIRANO AKIRA
分类号 H01L33/00;H01L33/12;H01L33/06;H01L33/18 主分类号 H01L33/00
代理机构 代理人
主权项 1. A method of manufacturing a nitride semiconductor ultraviolet light-emitting element comprising: a step of growing an AlN layer as an AlN crystal directly on a (0001) surface of a sapphire (0001) substrate and forming an underlying structure portion including the substrate and the AlN layer; and a step of forming a light-emitting element structure portion on a crystal surface of the underlying structure portion, the light-emitting element structure portion including an n-type cladding layer of an n-type AlGaN based semiconductor layer, an active layer having an AlGaN based semiconductor layer, and a p-type cladding layer of a p-type AlGaN based semiconductor layer; wherein the (0001) surface of the substrate is inclined at an off angle which is equal to or greater than 0.6° and is equal to or smaller than 3.0°; and an AlN molar fraction of the n-type cladding layer is equal to or higher than 50%.
地址 Aichi JP