发明名称 SUBSTRATE PROCESSING APPARATUS FOR ALIGNING SUBSTRATE WITH HIGH PRECISION AND HIGH SPEED, AND METHOD FOR ALIGNING POSITION OF SUBSTRATE
摘要 PURPOSE: A substrate processing apparatus and a method for adjusting a substrate transfer position are provided to align a substrate with high precision and high speed by obtaining previously position data of a substrate transfer mechanism. CONSTITUTION: A camera unit photographs a mark formed on a surface of a position aligning substrate. An operation unit calculates an amount of misalignment between a center of the position aligning substrate and a center of rotation of a substrate support member by using center position data of locations of the mark photographed before and after rotating the substrate support member by an angle of 180 degrees, respectively. A determination unit judges whether or not the position aligning substrate is aligned with the substrate support member from the amount of misalignment. An adjusting unit repositions the position aligning substrate by the substrate transfer mechanism to allow the center of the position aligning substrate to coincide with the center of rotation of the substrate support member when the position aligning substrate is not aligned with the substrate support member. A storage unit stores position data of the substrate transfer mechanism when the position aligning substrate is aligned with the center of the substrate support member.
申请公布号 KR20040104421(A) 申请公布日期 2004.12.10
申请号 KR20040040079 申请日期 2004.06.02
申请人 TOKYO ELECTRON LIMITED 发明人 DOUKI, YUICHI;ISHIMARU, KAZUTOSHI;ITO, KAZUHIKO;KINOSHITA, MICHIO;OOKURA, JUN
分类号 H01L21/68;B05B12/12;B05B13/02;H01L21/00;(IPC1-7):H01L21/68 主分类号 H01L21/68
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