发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device which can improve a magnetic shield effect.SOLUTION: A semiconductor device 20 comprises: a wiring board 30; a semiconductor element 40 mounted on an upper surface 30A of the wiring board 30; and a magnetic shield 50 which is provided on the upper surface 30A of the wiring board 30 so as to cover an upside and a lateral side of the semiconductor element 40 and made of a soft magnetic material. The magnetic shield 50 has a lateral plate part 51 which stands on the upper surface 30A of the wiring board 30 and a roof part 52 which covers the upside of the semiconductor element 40. The roof part 52 is composed of a vertex 53 and four straight slopes 54 which linearly slant from the vertex 53 toward the lateral plate part 51 in directions different from each other and formed in a square pyramid shape. Such magnetic shield 50 is formed in such a manner that a portion which overlaps the semiconductor element 40 in plan view, that is, the straight slopes 54 linearly slant with respect to the upper surface 30A of the wiring board 30.SELECTED DRAWING: Figure 1
申请公布号 JP2016171114(A) 申请公布日期 2016.09.23
申请号 JP20150048316 申请日期 2015.03.11
申请人 SHINKO ELECTRIC IND CO LTD 发明人 NAKAMURA MANABU;SHIMIZU YUKIO;INOUE NAHOMI
分类号 H01L23/00;H01L21/8246;H01L27/105;H05K9/00 主分类号 H01L23/00
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