| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing copper wiring which achieves excellent etching properties to a conductive film and excellent adhesion of formed copper wiring to the substrate.SOLUTION: The present invention relates to a method of manufacturing copper wiring, the method including at least: a coating film formation step to form a coating film by adding a conductive film forming composition comprising at least copper oxide nanoparticles, a polyalcohol, and a solvent and having a surface tension of 23-50 mN/m, onto one of a cycloolefin copolymer substrate and a cycloolefin polymer substrate which exhibit a glass-transition temperature of 130-190°C; a conductive film formation step to form a conductive film by sintering the coating film in a temperature range of ±30°C relative to the glass-transition temperature of the substrate under an atmosphere with an oxygen concentration of 3000 vol. ppm or less; a wiring pattern formation step to form copper wiring by etching the conductive film in a pattern by using an etchant.SELECTED DRAWING: None |
