| 发明名称 |
PHOTOSENSITIVE POLYIMIDE COMPOSITIONS |
| 摘要 |
This disclosure relates to a dry film structure that includes a carrier substrate, and a polymeric layer supported by the carrier substrate. The polymeric layer includes at least one fully imidized polyimide polymer. |
| 申请公布号 |
US2016313641(A1) |
申请公布日期 |
2016.10.27 |
| 申请号 |
US201615132472 |
申请日期 |
2016.04.19 |
| 申请人 |
Fujifilm Electronic Materials U.S.A., Inc. |
发明人 |
De Binod B.;Malik Sanjay;Sakamuri Raj;Reinerth William A.;Dimov Ognian N.;Naiini Ahmad A. |
| 分类号 |
G03F7/038;G03F7/40;G03F7/20;G03F7/32;H01L21/027;G03F7/16 |
主分类号 |
G03F7/038 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A dry film structure, comprising:
a carrier substrate; and a photosensitive polymeric layer supported by the carrier substrate; the photosensitive polymeric layer comprises at least one fully imidized polyimide polymer; wherein the photosensitive polymeric layer has a film thickness of at most about 5 microns. |
| 地址 |
North Kingstown RI US |
