| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition that forms an insulating layer having excellent adhesion to a conductor layer even with low roughness and having a high glass transition point, and an adhesive film, a prepreg, a printed wiring board, and a semiconductor device prepared therewith.SOLUTION: A resin composition comprises (A) epoxy resin, (B) maleimide-containing silyl protective phenol, and (C) active ester compound.SELECTED DRAWING: None |
