Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board

摘要

An object is to provide a resin composition that has excellent dielectric properties, that yields a highly heat-resistant cured product, that provides a low viscosity when made into a varnish, and that has a high Tg and a high flame retardancy without containing halogen. The resin composition contains a polyarylene ether copolymer (A) that has an intrinsic viscosity, measured in methylene chloride at 25° C., of 0.03 to 0.12 dL/g and that has an average of 1.5 to 3 phenolic hydroxyl groups in molecular terminal position per molecule, a triphenylmethane-type epoxy resin (B) that has a softening point of 50 to 70° C., and a cure accelerator (C), wherein the content of the polyarylene ether copolymer (A) is 60 to 85 mass parts where the total of the polyarylene ether copolymer (A) and the epoxy resin (B) is 100 mass parts.

主权项

1. A resin composition comprising a polyarylene ether copolymer (A) that has an intrinsic viscosity, measured in methylene chloride at 25° C., of 0.03 to 0.12 dL/g and that has an average of 1.5 to 3 phenolic hydroxyl groups in molecular terminal position per molecule, a triphenylmethane-type epoxy resin (B) that has a softening point of 50 to 70° C., a cure accelerator (C) and an at least difunctional epoxy resin (D) that is a liquid at 30° C., wherein:
the content of the polyarylene ether copolymer (A) is 60 to 85 mass parts where the total of the polyarylene ether copolymer (A) and the triphenylmethane-type epoxy resin (B) is 100 mass parts, and the content of the epoxy resin (D) is 7 to 23 mass parts where the total of the polyarylene ether copolymer (A), the triphenylmethane-type epoxy resin (B), and the at least difunctional epoxy resin (D) is 100 mass parts.