| 摘要 |
<p>To attach electronic components (3), in particular power semiconductors, to substrates (1), use is made of the pressure- sintering process in which the surfaces to be joined are pressed together at at least 900 N/cm<2> at the sintering temperature with a metal powder paste (10) being placed in between. Components (3) having a structured upper side can be pressure-sintered if they are placed, together with a body (14, 15) composed of elastically deformable material, for example silicone rubber, in a receiving chamber (11a, 11b, 18) which is sealed by a movable die (18) and which transmits the sintering pressure. On reaching the sintering pressure, the remaining interior space of the receiving chamber is completely filled by the deformable body (14, 15). …<IMAGE>… </p> |
