摘要 |
A composite film comprising an additive layer (5) and an insulating layer (4) containing an epoxy resin and a synthetic rubber as major components, is used in the manufacture of printed wiring boards via the additive method. The composite film is laminated on both sides of a substrate, especially an inner layer circuit substrate, and cured. Through-holes are drilled, and the resulting laminate is masked with a plating resist, roughened and electrolessly plated. |
申请人 |
HITACHI CHEMICAL CO., LTD., TOKIO/TOKYO, JP;HITACHI CONDENSER CO., LTD., TOKIO/TOKYO, JP;THE YOKOHAMA RUBBER CO., LTD., TOKIO/TOKYO, JP |
发明人 |
TAKAHASHI, HIROSHI, KASAMA-SHI, JP;TAKANEZAWA, SHIN, NUNOGAWA SHIMODATE-SHI, JP;KANNO, MASAO HITACHI KASEI KOGYO K.K., OZAKATA SHIMODATE-SHI, JP;OKAMURA, TOSHIRO, SHIMODATE-SHI, JP;FUKUTOMI, NAOKI, YUKI-SHI, JP;YOKOYAMA, HIROYOSHI, YUKI-SHI, JP;WATANABE, HIDEO, ASHIGARASHIMO-GUN KANAGAWA-KEN, JP;YAMAZAKI, HAJIME, HADANO-SHI, JP;WAKAMATSU, HIROYUKI, TAMA-KU KAWASAKI-SHI, JP;TAKAHASHI, TOSHINOBU, AIKO-GUN KANAGAWA-KEN, JP |