| 摘要 |
An electronic circuit module, having a small total thickness and excellent heat dissipation efficiency, and comprising insulating containers for holding electronic components therein and arranged between a thin metal board and a printed circuit board; surface contact connectors mounted between first planar surface contact terminals formed in the containers, and second planar surface contact formed on the printed circuit board, to make electrical connections therebetween; and securing means for securing the surface contact connectors to the metal board so that the connectors are lightly pressed between each container and printed circuit board. Pipes are disposed in the metal board for carrying coolant therein. Thus, heat generated by the electronic components is conveyed to the board via the containers, and hence to the outside for dissipation. The foregoing structure is advantageous in reducing the thickness of the module substantially, and in increasing the heat dissipation efficiency.
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