发明名称 TREATING APPARATUS FOR SUBSTRATE AND TREATMENT THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a treating apparatus for substrates constituted in such a manner that the substrates may be held in a perpendicular state and that the organic matter adhered to both flanks thereof may be well decomposed away. SOLUTION: The treating apparatus for the substrate, which decomposes away the organic matter adhered to the substrate by irradiating the substrate with UV rays, includes a main body 5 having a space part 6a in which the substrate 4 is housed in nearly the perpendicular state, a UV lamp 19 with which both flanks of the substrate housed in the space part are irradiated with the UV rays, respectively, a heater 9 which is disposed on or over the space part and heats the substrate housed in the space part to a prescribed temperature to accelerate the decomposition and removal of the organic matter by the UV rays and a discharge pump 12 which is disposed in communication with the lower part of the space part and discharges the atmosphere in the space part from the lower part.
申请公布号 JP2000334296(A) 申请公布日期 2000.12.05
申请号 JP19990151797 申请日期 1999.05.31
申请人 SHIBAURA MECHATRONICS CORP 发明人 FUJITA YUICHIRO
分类号 H01L21/205;B01J19/00;B01J19/12;F24F7/06;H01L21/304;(IPC1-7):B01J19/12 主分类号 H01L21/205
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