发明名称 Process for producing an integrated semiconductor memory configuration
摘要 Process for producing an integrated semiconductor memory configuration, in particular one suited to the use of ferroelectric materials as storage dielectrics, in which a conductive connection between one electrode of a storage capacitor and a selection transistor is not produced until after the storage dielectric has been deposited; and a semiconductor memory configuration produced using the production process.
申请公布号 US2001039106(A1) 申请公布日期 2001.11.08
申请号 US20010883011 申请日期 2001.06.15
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 HINTERMAIER FRANK;MAZURE-ESPEJO CARLOS
分类号 H01L21/02;H01L21/768;H01L21/8242;H01L21/8247;H01L27/10;H01L27/108;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L21/20 主分类号 H01L21/02
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