发明名称 |
Deposition uniformity control for electroplating apparatus, and associated method |
摘要 |
A method and associated apparatus for electro-chemically depositing a metal film on a substrate having a metal seed layer. The apparatus comprises a substrate holder that holds the substrate. The electrolyte cell receives the substrate in a processing position. The actuator is connected to the substrate holder and adjustably positions the substrate relative to the electrolyte cell. The method involves electro-chemically depositing a metal film on a substrate having a metal seed layer comprising disposing the substrate in an electrolyte cell that is configured to receive the substrate. The method comprises adjustably positioning the substrate relative to the electrolyte cell.
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申请公布号 |
US6837978(B1) |
申请公布日期 |
2005.01.04 |
申请号 |
US20000687053 |
申请日期 |
2000.10.12 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
HEY H. PETER W.;DORDI YEZDI N.;OLGADO DONALD J. K.;DENOME MARK |
分类号 |
C25D7/12;C25D21/12;H01L21/00;H01L21/288;H01L21/687;H05K3/24;(IPC1-7):C25D21/12;C25D5/00;C25D17/00 |
主分类号 |
C25D7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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