| 发明名称 |
Adhesive of folded package |
| 摘要 |
A package includes a flexible substrate with a first region and a second region, an encapsulated die supported by the first region, and a conformable fold adhesive introduced between the encapsulated die and the flexible substrate. The second region of the flexible substrate is folded over the surface of the encapsulated die.
|
| 申请公布号 |
US7033911(B2) |
申请公布日期 |
2006.04.25 |
| 申请号 |
US20040815540 |
申请日期 |
2004.03.31 |
| 申请人 |
INTEL CORPORATION |
发明人 |
MANEPALLI RAHUL N.;PAGHASIAN KAREN Y.;KOURAKATA SHINOBU;ARANDA RUEL D R |
| 分类号 |
H01L21/30;H01L21/46;H01L23/28;H01L23/538;H01L25/065 |
主分类号 |
H01L21/30 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
