| 摘要 |
<p>PROBLEM TO BE SOLVED: To make feasible of rapid operation by avoiding the multiple reflection due to inaccessible module even if clock frequency is increased high than before, when a variety of modules are inserted into a socket for electrically connecting bus and modules on a printed substrate. SOLUTION: A switch array 11 is formed in the thickness of about 2 mm. On the surface of the switch array 11, electrodes 13a-13d are alternately provided on both sides thereon. Likewise, on the surface of the backside thereof, corresponding electrodes are provided. The semiconductor chips sealed inside the switch array 11 are arranged so that the chip faces may be parallel with the upper and lower faces of the switch array 11. In such a constitution, the electrodes 13a-13d are bent upward while the electrodes 14a-14d are bent downward.</p> |
