| 摘要 |
PROBLEM TO BE SOLVED: To provide an instrument capable of measuring automatically a changing process in a plating film thickness in line, in a plating process for forming the plating film on a circumferential face of a cylinder. SOLUTION: This plating film thickness measuring instrument is provided with a displacement sensor for measuring a displacement in the circumferential face of a cylinder to be plated, while rotated in a plating vessel, to output a displacement signal, a squeegee for scraping a plating liquid deposited on the circumferential face of the cylinder, in order to bring a plating liquid removed condition on the circumferential face of the cylinder in a measuring position of the displacement, a rotation sensor for detecting rotation of the cylinder to output a rotation signal, a data processing means for inputting the displacement signal and the rotation signal to compute the plating film thickness, based on a deviation between an initial value of the displacement at a prescribed rotational angle and a progress value of the displacement when measured after a prescribed lapse time, and a display means for displaying the plating film thickness. COPYRIGHT: (C)2008,JPO&INPIT
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