| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition, exhibiting excellent insulation even in low-temperature burning at 150°C. <P>SOLUTION: This photosensitive resin composition includes: (a) polyamide resin, (b) acrylic resin, (c) a photoacid generator, and (d) heat cross-linking compound, wherein the weight average molecular weight of (b) the acrylic resin is 5,000-30,000. <P>COPYRIGHT: (C)2009,JPO&INPIT |
