| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a counter target type sputtering apparatus capable of forming a film having higher reliability, and to provide a method of manufacturing a liquid crystal device. Ž<P>SOLUTION: The sputtering apparatus 1 includes: a film forming chamber 2 that houses a substrate W held so as to be carried in a horizontal direction; a sputtered particle ejecting section 3 that generates sputtered particles 5P by plasma from a pair of targets 5a, 5b disposed so as to face each other in an oblique state with respect to the substrate W, and ejects the sputtered particles 5P through an opening 25 toward the substrate W carried from the upper target 5a side to the lower target 5b side; and a slit member 50 that has a slit S through which the sputtered particles 5P are selectively passed, and is disposed between the substrate W and the sputtered particle ejecting section 3. The slit member 50 is disposed so that a slit open end of the slit S in an upstream side of the conveying direction of the substrate W may be positioned within 50 mm toward the upstream side from an open end in the upstream side of the opening 25 of the sputtered particle ejecting section 3. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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