ELECTROLESS NICKEL PLATING SOLUTION, ELECTROLESS NICKEL PLATING METHOD USING SAME, AND FLEXIBLE NICKEL PLATED LAYER FORMED BY USING SAME

摘要

The present invention provides an electroless nickel plating solution supplying high flexibility to a plated layer and having improved stability. The electroless nickel plating solution according to an embodiment of the present invention is an electroless nickel plating layer using an electroless nickel plating method. The electroless nickel plating solution comprises: a nickel metal salt providing a nickel ion for plating, and containing sulfamic acid nickel; a reducer reducing the nickel ion for plating; a complexing agent forming a complex together with the nickel ion for plating; and a cyan-based stabilizer providing stability of the electroless plating solution and preventing the generation of pits in a flexible nickel plated layer.

主权项

1. An electroless nickel plating solution that forms a flexible nickel plated layer by using an electroless nickel plating method, the electroless nickel plating solution comprising:
a nickel metal salt that provides a nickel ion used for plating, and contains sulfamic acid nickel; a reducer that reduces the nickel ion used for plating; a complexing agent that forms a complex with the nickel ion used for plating; and a cyan-based stabilizer that provides stability to the electroless nickel plating solution and prevents the generation of pits in the flexible nickel plated layer.