发明名称 THERMAL MITIGATION IN DEVICES WITH MULTIPLE PROCESSING UNITS
摘要 A method of thermal mitigation in a device having a plurality of non-real-time processing units (PUs) and a plurality of real-time PUs, including connecting each of the plurality of real-time PUs and the plurality of non-real-time PUs to a first power supply, and performing thermal mitigation. Performing thermal mitigation includes disconnecting each of the plurality of non-real-time PUs except one of the plurality of non-real-time PUs from the first power supply resulting in an active non-real-time PU, and connecting a second power supply that derives power from the first power supply to the active non-real-time PU, wherein a voltage supplied by the second power supply is less than a voltage supplied by the first power supply.
申请公布号 WO2016105685(A1) 申请公布日期 2016.06.30
申请号 WO2015US60467 申请日期 2015.11.12
申请人 QUALCOMM INCORPORATED 发明人 GUPTA, NIKESH;TIWARI, HARSHIT;BAJAJ, ASHISH;SINGH, MAHESHWAR THAKUR
分类号 G06F1/32;H04W52/02 主分类号 G06F1/32
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