发明名称 |
THERMAL MITIGATION IN DEVICES WITH MULTIPLE PROCESSING UNITS |
摘要 |
A method of thermal mitigation in a device having a plurality of non-real-time processing units (PUs) and a plurality of real-time PUs, including connecting each of the plurality of real-time PUs and the plurality of non-real-time PUs to a first power supply, and performing thermal mitigation. Performing thermal mitigation includes disconnecting each of the plurality of non-real-time PUs except one of the plurality of non-real-time PUs from the first power supply resulting in an active non-real-time PU, and connecting a second power supply that derives power from the first power supply to the active non-real-time PU, wherein a voltage supplied by the second power supply is less than a voltage supplied by the first power supply. |
申请公布号 |
WO2016105685(A1) |
申请公布日期 |
2016.06.30 |
申请号 |
WO2015US60467 |
申请日期 |
2015.11.12 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
GUPTA, NIKESH;TIWARI, HARSHIT;BAJAJ, ASHISH;SINGH, MAHESHWAR THAKUR |
分类号 |
G06F1/32;H04W52/02 |
主分类号 |
G06F1/32 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|