Integrated circuit packaging system with molded laser via interposer and method of manufacture thereof

摘要

A method of manufacture of an integrated packaging system includes: providing a substrate; mounting an integrated circuit on the substrate; mounting an interposer substrate having an interposer pad on the integrated circuit; covering an encapsulant over the integrated circuit and the interposer substrate; forming a hole through the encapsulant aligned over the interposer pad; and placing a conductive connector on and in direct contact with the interposer pad.

主权项

1. An integrated circuit packaging system comprising:
a substrate; an integrated circuit on the substrate; an interposer substrate having interposer pads on the integrated circuit; an encapsulant around the integrated circuit and the interposer substrate with holes in the encapsulant aligned over the interposer pads, the holes being wider at the bottom and top of the holes than the middle of the holes; and a conductive connector on and in direct contact with the interposer pads, in the holes in the encapsulant, and embedded in the encapsulant.