| 发明名称 |
PRINTED CIRCUIT BOARD, PACKAGE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A printed circuit board includes: a core board including, on a first surface thereof, an element mounting part and an element non-mounting part; an insulation layer disposed on the element non-mounting part; a copper-clad laminate plate disposed on the insulation layer; a first penetration via penetrating the insulation layer and the copper-clad laminate plate; and a second penetration via disposed in the core board and connected to the first penetration via. |
| 申请公布号 |
US2016205780(A1) |
申请公布日期 |
2016.07.14 |
| 申请号 |
US201614989558 |
申请日期 |
2016.01.06 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
Lee Jae-Ean;Mok Jee-Soo;Ko Young-Gwan;Ko Kyung-Hwan;Baek Yong-Ho |
| 分类号 |
H05K1/18;H05K1/03;H05K1/02;H05K3/30;H05K3/46;H05K1/11;H05K3/00 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board, comprising:
a core board comprising, on a first surface thereof, an element mounting part and an element non-mounting part; an insulation layer disposed on the element non-mounting part; a copper-clad laminate plate disposed on the insulation layer; a first penetration via penetrating the insulation layer and the copper-clad laminate plate; a second penetration via disposed in the core board and connected to the first penetration via. |
| 地址 |
Suwon-si KR |
