发明名称 Suspension board assembly sheet with circuits and method for manufacturing the same
摘要 A plurality of suspension boards and an inspection substrate are integrally supported by a support frame. In each suspension board, a line is formed on a conductive first support substrate via a first insulating layer. The first support substrate and the line are electrically connected by a first via in the first insulating layer. In the inspection substrate, a conductor layer is formed on a conductive second support substrate with a second insulating layer sandwiched therebetween. The second support substrate and the conductor layer are electrically connected by a second via in the second insulating layer. The first via and the second via have the same configuration.
申请公布号 US9451704(B2) 申请公布日期 2016.09.20
申请号 US201314062264 申请日期 2013.10.24
申请人 NITTO DENKO CORPORATION 发明人 Ihara Terukazu;Ishii Jun;Terada Naohiro
分类号 H05K1/00;H05K3/10;G11B5/48;H05K3/00;H05K3/46;H05K1/02;H05K1/05;H05K3/06 主分类号 H05K1/00
代理机构 Panitch Schwarze Belisario & Nadel LLP 代理人 Panitch Schwarze Belisario & Nadel LLP
主权项 1. A suspension board assembly sheet with circuits comprising: a plurality of suspension boards with circuits; an inspection substrate; and a support frame that integrally supports the plurality of suspension boards with circuits and the inspection substrate, wherein each of the plurality of suspension boards with circuits includes a conductive first support substrate, a first insulating layer formed on the first support substrate, a conductor line formed on the first insulating layer and a first via that passes through the first insulating layer and electrically connects the first support substrate and the conductor line, and the inspection substrate includes a conductive second support substrate, a second insulating layer formed on the conductive second support substrate, a conductor layer formed on the second insulating layer, and a second via that passes through the second insulating layer and electrically connects the conductive second support substrate and the conductor layer, and the first via and the second via have the same configuration, wherein the second insulating layer has an opening that is formed such that part of the conductive second support substrate is exposed.
地址 Ibaraki-Shi, Osaka JP