发明名称 Electronic package structure
摘要 The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.
申请公布号 US9451701(B2) 申请公布日期 2016.09.20
申请号 US201514594083 申请日期 2015.01.10
申请人 CYNTEC Co., Ltd. 发明人 Chen Da-Jung;Liu Chun-Tiao;Lu Bau-Ru
分类号 H05K7/00;H05K1/18;H01L23/64;H01L25/16;H01F27/24;H01F27/29;H01F27/40;H01F27/02;H05K3/34;H01L23/24;H01L23/31;H01L23/552;H01L23/00 主分类号 H05K7/00
代理机构 Litron Patent and Trademark Office 代理人 Teng Min-Lee;Litron Patent and Trademark Office
主权项 1. A choke, comprising: a coil, comprising at least one winding turn of a conductive wire; a magnetic body, wherein the coil is disposed in the magnetic body and the magnetic body comprises a contiguous portion enclosing therein said at least one winding turn of the conductive wire of the coil and extending through a hollow space enclosed by the coil, wherein a cavity is formed on a top surface of the magnetic body and the bottom surface of the cavity is entirely formed by a surface of said contiguous portion of the magnetic body, wherein at least one conductive element is disposed in the cavity, wherein said at least one winding turn of the conductive wire and said at least one conductive element are located at two opposite sides of the bottom surface of the cavity.
地址 Hsinchu TW
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