发明名称 SEMICONDUCTOR MODULE
摘要 PROBLEM TO BE SOLVED: To provide a small-sized semiconductor module that has a built-in insulation element.SOLUTION: A semiconductor module 10 comprises: a first semiconductor element 11 provided with a first light-receiving circuit 11a and a first output circuit 11b; a second semiconductor element 21 provided with a second light-receiving circuit 21a and a second output circuit 21b; a first light-emitting element 13 electrically connected with the second output circuit 21b, and placed on the first semiconductor element 11 so that first radiation light 12 is received by the first light-receiving circuit 11a; and a second light-emitting element 23 electrically connected with the first output circuit 11b, and placed on the second semiconductor element 21 so that second radiation light 22 is received by the second light-receiving circuit 21a.SELECTED DRAWING: Figure 1
申请公布号 JP2016171235(A) 申请公布日期 2016.09.23
申请号 JP20150050852 申请日期 2015.03.13
申请人 TOSHIBA CORP 发明人 OKUMURA NAOHISA;SENDA DAISUKE;KISHI HIROAKI;OGAWA ISAO;KOSEKI MASARU
分类号 H01L25/04;H01L25/18;H01L31/12 主分类号 H01L25/04
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