| 摘要 |
PROBLEM TO BE SOLVED: To provide a connection structure capable of suppressing floating of a semiconductor chip, and a method for manufacturing the connection structure.SOLUTION: A connection structure comprises: a semiconductor chip 10 including a plurality of connection terminals; a translucent substrate 20 including a plurality of metal terminals corresponding to the plurality of connection terminals; and a photocurable adhesive film 30 obtained by photocuring a photocurable adhesive composition for connecting the plurality of connection terminals and the plurality of metal terminals. The difference between the reaction rate between the metal terminals of the photocurable adhesive composition, and the reaction rate in a metal terminal end part of the photocurable adhesive composition is 70% or less. The difference between the reaction rate between the metal terminals of the photocurable adhesive composition, and the reaction rate in the metal terminal end part of the photocurable adhesive composition is small, thereby making it possible to suppress floating of the semiconductor chip.SELECTED DRAWING: Figure 1 |
