发明名称 LOW PROFILE MULTI-ANODE ASSEMBLY
摘要 PROBLEM TO BE SOLVED: To provide a capacitor assembly configured to effectively dissipate heat when exposed to a high ripple current.SOLUTION: The assembly includes a plurality of capacitor elements, each including an anode body and lead, a dielectric layer overlying the anode body, and a solid electrolyte. Each capacitor element is defined by upper and lower major surfaces, first opposing minor surfaces, and second opposing minor surfaces. The major surfaces each have a surface area greater than that of each of the minor opposing surfaces. A hermetically sealed housing having a length, width, and height defines an interior cavity within which the plurality of capacitor elements is positioned. The ratio of the length to the height ranges from about 2 to about 80. Further, the lower major surface of each capacitor element faces a lower wall of the housing, and the lower wall is defined by the housing's length and width.SELECTED DRAWING: None
申请公布号 JP2016171325(A) 申请公布日期 2016.09.23
申请号 JP20160048711 申请日期 2016.03.11
申请人 AVX CORP 发明人 PETRZILEK JAN;NAVRATIL JIRI;MARTIN BILER
分类号 H01G9/26;H01G2/04;H01G9/028;H01G9/052;H01G9/06;H01G9/08 主分类号 H01G9/26
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