发明名称 |
METHODS AND APPARATUS FOR CUTTING A SUBSTRATE |
摘要 |
Methods and apparatus for cutting a substrate are disclosed. In one arrangement, a plurality of recesses are formed in the surface of the substrate. The recesses as such that a stress can be applied to the substrate that is concentrated by the recesses. The concentrated stress causes the substrate to be cut along a cutting line that passes through the recesses. The cutting occurs via propagation of a crack through the recesses. |
申请公布号 |
WO2016150774(A1) |
申请公布日期 |
2016.09.29 |
申请号 |
WO2016EP55592 |
申请日期 |
2016.03.15 |
申请人 |
NATIONAL UNIVERSITY OF IRELAND, GALWAY |
发明人 |
O'CONNOR, Gerard;COLLINS, Adam |
分类号 |
C03B33/02;B23K26/364;B23K103/00 |
主分类号 |
C03B33/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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