发明名称 Curable resin composition and cured product thereof, encapsulant, and semiconductor device
摘要 Provided is a curable resin composition capable of forming a cured product that has excellent heat resistance and transparency and, in particular, offers excellent barrier properties to a corrosive gas. The curable resin composition according to the present invention includes a polyorganosiloxane (A), an isocyanurate compound (B), and a silane coupling agent (C). The polyorganosiloxane (A) is an aryl-containing polyorganosiloxane. The polyorganosiloxane (A) preferably includes a polyorganosiloxane having a number-average molecular weight (Mn) of 500 to 4000 as determined by gel permeation chromatography and calibrated with a polystyrene standard.
申请公布号 US9481791(B2) 申请公布日期 2016.11.01
申请号 US201414767861 申请日期 2014.02.04
申请人 DAICEL CORPORATION 发明人 Kamuro Shigeaki;Nakagawa Yasunobu
分类号 C08G77/24;C08L83/06;C08L83/04;C08K5/5435;C09D183/04;H01L23/29;C08K5/54;C08G77/12;C08G77/20;C08G77/00;H01L33/56;C08K5/3492 主分类号 C08G77/24
代理机构 Birch, Stewart, Kolasch & Birch, LLP 代理人 Birch, Stewart, Kolasch & Birch, LLP
主权项 1. A curable resin composition comprising: a polyorganosiloxane (A) excluding a silsesquioxane; an isocyanurate compound (B); and a silane coupling agent (C), the polyorganosiloxane (A) being an aryl-containing polyorganosiloxane, the aryl-containing polyorganosiloxane having: a number-average molecular weight (Mn) of from 500 to 4000 as determined by gel permeation chromatography and calibrated with a polystyrene standard; and a molecular-weight dispersity (Mw/Mn) of from 0.95 to 4.00, where the aryl-containing polyorganosiloxane has a weight-average molecular weight of Mw and a number-average molecular weight of Mn as determined by gel permeation chromatography and calibrated with a polystyrene standard, the polyorganosiloxane (A) comprising: a polyorganosiloxane (A1) comprising an aliphatic carbon-carbon double bond; anda polyorganosiloxane (A2) comprising a Si—H bond, the polyorganosiloxane (A) comprising 50 percent by weight or more of the polyorganosiloxane (A2) comprising a Si—H bond based on the total amount (100 percent by weight) of the polyorganosiloxane (A), and the isocyanurate compound (B) comprising an isocyanurate compound represented by Formula (1):wherein Rx, Ry, and Rz are each, identically or differently, selected from a group represented by Formula (2) and a group represented by Formula (3), where at least one of Rx, Ry, and Rz is the group represented by Formula (3):wherein R1 and R2 are each, identically or differently, selected from hydrogen and C1-C8 straight or branched chain alkyl.
地址 Osaka-Shi, Osaka JP