| 摘要 |
PROBLEM TO BE SOLVED: To suppress a deterioration in cooling performance of an electronic component.SOLUTION: An electronic apparatus 1 includes an electronic substrate 10 and a cooling part 20. The electronic substrate 10 is formed of an insulation material and having a bare chip 14 mounted thereon. The cooling part 20 is made of stainless steel (SUS). A channel is formed within the cooling part 20, and pure water flows through the channel. A thermosetting adhesive material is applied to adhesive surfaces of the electronic substrate 10 and the cooling part 20, and the electronic substrate 10 and the cooling part 20 are bonded together by thermal hardening of the adhesive material.SELECTED DRAWING: Figure 1 |
