PRESSURE-SENSITIVE ADHESIVE SHEET FOR SEMICONDUCTOR PROCESSING

摘要

PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet for semiconductor processing, excellent in bump absorbency and capable of preventing the residue of an adhesive to a bump part from occurring without breaking an adhesive layer when peeled from a semiconductor wafer since damage is caused by a difference of elevation between a portion having a bump and a portion having no bump when the rear surface of the semiconductor wafer is ground and thinned.SOLUTION: A pressure-sensitive adhesive sheet 10 for semiconductor processing includes an intermediate layer 2 having a storage elastic modulus I of 200,000 Pa or less measured at a frequency of 1 Hz and a temperature of 50°C and an adhesive layer 1 formed from an energy beam curing rubber based adhesive in this order on a base material 3.SELECTED DRAWING: Figure 1