发明名称 BONDING DEVICE
摘要 Provided is a bonding apparatus including a table (52), a first reaction member (58A) and a second reaction member (58B), which are each provided movably in a Y axis direction with respect to a pedestal (41). The first and second reaction members are each configured to move in a direction opposite to the table in the Y axis direction when the table moves in the Y axis direction. As viewed in an X axis direction, the first and second reaction members are arranged on both sides of the table, respectively, with the table being interposed between the first and second reaction members, so that the centers of gravity of the first and second reaction members are positioned based on the center of gravity of the table. Consequently, the bonding apparatus can suppress an increase in space, and can improve a weight balance on the pedestal.
申请公布号 SG11201608267T(A) 申请公布日期 2016.11.29
申请号 SGT11201608267 申请日期 2014.09.30
申请人 SHINKAWA LTD. 发明人 KAKUTANI OSAMU;TAZAWA HIDEHIRO;TUJI MASAHITO
分类号 H01L21/52;H01L21/60 主分类号 H01L21/52
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