发明名称 Method for producing self-aligned metallisations for FET
摘要 Method for producing self-aligned metallisations for FET on a semiconductor body (2) having a web (1), which involves applying a gold layer (4) over the entire surface area of the semiconductor body (2), and a gap each being etched at the edges of the web (1) into the gold layer (4) grown there in a porous manner at the sides of the web (1), the base width (6) of the gap being defined by the duration of the etching process. <IMAGE>
申请公布号 DE3840226(A1) 申请公布日期 1990.05.31
申请号 DE19883840226 申请日期 1988.11.29
申请人 SIEMENS AG, 1000 BERLIN UND 8000 MUENCHEN, DE 发明人 LAUTERBACH, CHRISTL, 8011 SIEGERTSBRUNN, DE
分类号 H01L21/28;H01L21/337;H01L29/45;H01L29/47;H01L29/49 主分类号 H01L21/28
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