发明名称 |
Method for producing self-aligned metallisations for FET |
摘要 |
Method for producing self-aligned metallisations for FET on a semiconductor body (2) having a web (1), which involves applying a gold layer (4) over the entire surface area of the semiconductor body (2), and a gap each being etched at the edges of the web (1) into the gold layer (4) grown there in a porous manner at the sides of the web (1), the base width (6) of the gap being defined by the duration of the etching process. <IMAGE>
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申请公布号 |
DE3840226(A1) |
申请公布日期 |
1990.05.31 |
申请号 |
DE19883840226 |
申请日期 |
1988.11.29 |
申请人 |
SIEMENS AG, 1000 BERLIN UND 8000 MUENCHEN, DE |
发明人 |
LAUTERBACH, CHRISTL, 8011 SIEGERTSBRUNN, DE |
分类号 |
H01L21/28;H01L21/337;H01L29/45;H01L29/47;H01L29/49 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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