| 摘要 |
PURPOSE: A CSP(Chip Scale Package) and manufacturing method thereof are provided to simplify manufacturing processes and to economize fabrication costs by omitting wire bonding and to improve solder joint reliability by connecting a solder ball to a solder made of the same material as the solder ball. CONSTITUTION: A CSP includes a semiconductor chip(61) with bonding pads, a first solder resist, a solder, a second solder resist and a solder ball. The bonding pads(62) are arranged at the center of the semiconductor chip. The first solder resist(63) includes an opening portion for exposing the bonding pads to the outside and a recessed portion. The solder(64) is formed on the exposed bonding pads and the recessed portion of the first solder resist. The second solder resist(65) for exposing selectively the solder to the outside is formed thereon. The solder ball(66) is attached to the exposed solder through the second solder resist.
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