| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor wafer carrier for a double-sided polishing machine which can lap or polish one side of the wafer with a double-sided polishing machine without using wax. <P>SOLUTION: In the wafer carrier 1 for a double-sided polishing machine which is equipped with a hole 2 for housing a wafer which houses and holds a semiconductor wafer 20 to be double-side polished and which is revolved while being rotated in a state of being held between an upper surface plate 10 and a lower surface plate 30 or between abrasive cloths, with the semiconductor wafer 20 being housed and held inside the hole 2 for housing a wafer, the hole 2 for housing a wafer which houses and holds the semiconductor wafer 20 is formed as a blind hole consisting of a concave portion shallower than the thickness of the semiconductor wafer 20. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
