| 摘要 |
PROBLEM TO BE SOLVED: To realize a semiconductor integrated circuit device which is equipped with a large number of pins and enhanced in electrical properties. SOLUTION: A semiconductor integrated circuit device is composed of a device mounting board 3 which is provided with a recess 3b that houses a semiconductor device 1, a bump connection surface 3a connected to bumps 2, and provided with an opening 3c flush with the connection surface 3a and a cap member 4 equipped with an outer exposed surface 4a which seals up the recess 3b and a bump connecting metallized film 4b which connects bumps 2 to the outer exposed surface 4a, wherein the device mounting board 3 and the cap member 4 are so arranged as to make the bump connecting surface 3a of the device mounting board 3 and the outer exposed surface 4a of the cap member 4 located on the same side. Furtlnermore, the electrode 1a of the semiconductor device 1 and the bump connecting metallized film 4b of the cap member 4 are electrically connected and bonded together. |
