| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent excessive diffusion to adjacent circuits by forming a structure on the substrate side for releasing conductive agent housing an excessive conductive adhesive which is diffused plane-wise due to the pressure by the parts mounted on the surface thereby absorbing unevenness in the amount of coating the conductive adhesives. SOLUTION: A recessed portion 10a formed in a substrate 70 is formed directly below a chip resistor 101, and a recessed portion for housing unnecessary conductive adhesive 50 is formed. This shape may be a square hole, a round hole or line-shaped grooves. By doing this, an excessive conductive adhesive 50 is dropped and placed in the excavated portion 10a, so that it does not spread to other conductive adhesive 50. As a result, the occurrence of a short-circuit between both the pads 74 can be decreased. In this way, the dispersion in the fluctuation of the amount of coating can be absorbed to a certain degree, so that the quality of the hybrid IC products can be enhanced.</p> |
