| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent increase in size of an element and increase in manufacturing processes for a mounting board, and restrain inclination of a mounted element, by forming a protrusion for supporting a semiconductor element in contact, near a wiring pattern at a mounting position of the semiconductor element to be directly mounted on the board surface. SOLUTION: On lateral sides of electric wirings 106a, 106b on a semiconductor element mounting board 101 for mounting a semiconductor element 200 thereon, solder metals 103a-103d for supporting the semiconductor element which are not related to electrical and mechanical connection between the semiconductor element 200 and the board 101 are provided. By supporting the semiconductor element 200 by the solder metals 103a-103d, the semiconductor element 200 is prevented from being inclined and erroneously contacting the electric wiring. Thus, a function to prevent a short circuit due to inclination may be provided simultaneously with formation of the electric wiring and the solder metal on the board, simply by adding some patterns, without causing increase in cost due to increase in size of the semiconductor element or increase in board working processes.</p> |
