发明名称 Method of forming dual metal gate structures for CMOS devices
摘要 An embodiment of the instant invention is a method of forming a first transistor having a first gate electrode and a second transistor having a second gate electrode on a semiconductor substrate, the method comprising the steps of: forming a conductive material (step 216 of FIGURE 2) insulatively disposed over the semiconductor substrate, the conductive material having a work function; and altering a portion of the conductive material (step 218 of FIGURE 2) so as to change the work function of the altered conductive material, the conductive material to form the first gate electrode and the altered conductive material to form the second gate electrode. Preferably, the first transistor is an NMOS device, the second transistor is a PMOS device, and the first transistor and the second transistor form a CMOS device. The conductive material is, preferably, comprised of a conductor selected from the group consisting of: Ta, Mo, Ti and any combination thereof. Preferably, the step of altering a portion of the conductive material is comprised of: subjecting the portion of the conductive material to a plasma which incorporates a nitrogen-containing gas. <IMAGE>
申请公布号 EP1032033(A2) 申请公布日期 2000.08.30
申请号 EP20000103406 申请日期 2000.02.24
申请人 TEXAS INSTRUMENTS INCORPORATED 发明人 WILKS, GLEN D.;SUMMERFELT, SCOTT R.
分类号 H01L27/092;H01L21/28;H01L21/336;H01L21/8238;H01L29/423;H01L29/49;(IPC1-7):H01L21/823;H01L21/823 主分类号 H01L27/092
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