| 摘要 |
PROBLEM TO BE SOLVED: To reduce a crosstalk in a high-density head by forming a diaphragm of a laminate of a resin film and an SUS material, and constituting a thickness of a resin film in a specific range to a lateral width of a liquid chamber. SOLUTION: A laminated piezoelectric element 2 is disposed at a predetermined interval on a head board, and a diaphragm 3 made of a laminate of a polyimide film 4 as a resin film and an SUS material 5 is connected to the element 2. A liquid chamber partition wall member for forming a liquid chamber partition wall 7 is connected onto the diaphragm 3, and further a channel forming member 8 for forming a nozzle communicating passage and a nozzle 10 formed with a nozzle 11 are sequentially laminated on the member. Then, a thickness T of the film 4 is set to the range of substantially 0.035*W<T<0.065*W, wherein T is the thickness of the film 4, and W is a lateral width of the chamber 12. Thus, a crosstalk can be reduced.
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