发明名称 RESIN COMPOSITION AND HEAT RAY AND/OR ULTRAVIOLET SHIELDING MATERIAL UTILIZING THE SAEM COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide resin compositions in which fine inorganic particles have been uniformly dispersed in a polymer and heat ray and/or ultraviolet shielding materials excellent in transparency. SOLUTION: Resin compositions comprises a polymer having 0.0002-2 mol/kg acid group and/or amino group per molecule and a structure in which an alkylene group having not less than three carbon atoms is sandwiched between two hetero atoms directly or through carbon and inorganic fine particles having an average particle diameter of not greater than 100 nm. The inorganic fine particles are preferably of a metal oxide having heat ray and/or ultraviolet shielding capability.
申请公布号 JP2000336278(A) 申请公布日期 2000.12.05
申请号 JP20000084077 申请日期 2000.03.24
申请人 NIPPON SHOKUBAI CO LTD 发明人 SHIMIZU KENJI;NISHIDA TOSHIBUMI;NODA NOBUHISA;AOYAMA TAKAHIRO;TAKEDA MITSUO
分类号 C08J5/18;C08K3/22;C08K7/18;C08L101/00;C08L101/06;(IPC1-7):C08L101/06 主分类号 C08J5/18
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