| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for a heat-dissipating material and its cured product excellent not only in thermal conductivity but also in moldability and flexibility of a heat-dissipating sheet therefrom. SOLUTION: This resin composition for the heat-dissipating material comprises a liquid resin essentially comprising a liquid oily substance and a crosslinkable polymer, where the liquid resin forms gel characterized in that the gel has hardness of 5-80. COPYRIGHT: (C)2005,JPO&NCIPI
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